Description
Relative products informations for your reference:
1. Layer: 1-10
2. Board finished thickness: 0.2mm-3.5mm
3. Material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers, FR-1, FR-2
4. Max. finished board size: 500MM*600(20''*24'')
5. Min. drilled hole size: 0.20mm(8mil)
6. Min. line width: 0.10(4mil)
Min. Line spacing: 0.10(4mil)
7. Surface finish/treatment: HASL/HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/ Gold, OSP, Gold plating
8.Copper thickness: 0.5-2.0 oz
9.Solder mask color: green/yellow/black/white/red/blue
10. Inner Packing: Vacuum packing/Plastic bad
11.Outer packing: Standard carton packing
12.Shape tolerance: ±0.13
13.Hole tolerance: PTH: ±0.076, NPTH: ±0.05
14.Profiling: Punching, Routing, V-CUT, Beveling
15.Special requirements: Buried and blind vias +controlled Impedance + BGA
16.Certificate: UL, ISO9001:2000, SGS, RoHS, CQC